Thermal characterization is crucial for comprehending the behavior of complex electronics. It involves analyzing and measuring heat generation, dissipation, and management. This article provides a basic overview of thermal characterization, including structure and function of electronic components, and various techniques and tools used in the field. Get a better understanding of thermal characterization and its significance in ensuring the reliability and safety of electronic components.

The evolution of power, size, and temperature in electronics design has led to new challenges in system reliability and lifetime. In the past, overheating of critical components was the major cause of system breakdown, but today, other issues also arise. Cooling is a 3D effect, and accurate thermal characterization is necessary for optimal design. The development of thermal transient measurements has culminated in the Cauer-ladder network model and the Simcenter T3STER™ thermal transient analysis software system. Using structure functions, engineers can now identify the physical characteristics of layers and evaluate the thermal performance at the system level, from LED packages to laptops and laser printers.